Manufacturing
Q Products is a professional electronics assembly company, equipped with the latest equipment. This enables us to be fully ISO-certified as your “Key Supplier”.
We assemble, test and build various electronics products. This can be from a semi-manufactured up to and including a complete Box Build end product. Within this assembly process we have the following specialisms: Prototyping, Screen Printing, SMD, Reflow, Through-Hole, Wave soldering, Manual soldering, Coating / Potting, Assembly.
Read more about our specialties in the field of assembly below:
Prototyping:
Within our organization we have a special proto line. We have the ability to quickly and flexibly produce different numbers of protos for you based on a first design. This gives you equal knowledge about the manufacturability of your product. With these first prototypes you can test the functionality of your product.
Our experience shows that unforeseen problems can arise during the production of a prototype. Thanks to the knowledge and solution-oriented approach of our qualified employees, these problems can be remedied quickly, so that you will soon have a first prototype. Our employees can also produce a prototype for you manually. We have special equipment to realize this, including a BGA installation station
Screen printing:
For applying the SMD paste by means of screen printing, we use a DEK Horizon 03I.
This machine was chosen because it fully automatically performs the screen process whereby the quality is monitored by the internal control system, in combination with automatic screen cleaning.
It has been found that the quantity, position and distribution of the paste over the contact surface play an important role in smd production.
Marantz SX2 Pasta Inspection
Marantz SX2 Pasta Inspection
With the help of the 3D paste inspection machine, we are able to make a good control stroke in no time.
The 3D paste inspection machine offers us the following four possibilities:
Set / fine-tune screen process
Process monitoring
Incident detection
Process Reflection
Reflow:
For the reflow process within the SMD department, we use:
Mark3-1707 reflow oven
The 1707 Mark III has 7 heating zones, both above and below and 1 cooling zone and can be used for both lead and lead free.
In determining the correct soldering profile, many variables that play a role, such as:
Soldering specifications of components
Execution of the pcb
Mass of the pcb and its components
Soldering specifications of the solder paste
Institutions are predetermined by an analysis. These are verified during the process by means of 6 thermocouples. The starting point is to obtain optimal soldering that falls within the IPC standard as a minimum.
Through-Hole:
CBs are assembled batch-wise in our through hole assembly department.
The assembly tables used by us offer the possibility to quickly switch between large series productions and small prototype series. After assembling, the prints are soldered by the double wave solder.
Components that can not be soldered by machine are manually installed afterwards.
SMD:
Surface-mounted device, abbreviation SMD, literally means surface-mounted part. Unlike a through-hole component, an SMD component is not mounted using connectors through the circuit board, but against the circuit board.
Q Products has three Mycronic pick and place machines in terms of smd technology. The combination of a ‘screen printer’, ‘pick and place machine’ and ‘reflow oven’ make it possible to produce large series. It is also possible to process ‘0201’ components, ‘finepitch ICs’ (0.2 pitch) and ‘Ball Grid Arrays’ (including µBGAs). Short programming and set-up times and an integrated glue station provide the desired flexibility for prototyping and small series.
Advantages of the SMD technology are:
More favorable mechanical properties which means less space is needed for a component on a printed circuit board, making electrical appliances smaller and / or more complex. Also, components can be placed on both sides of the PCB, because the connection points do not run through the PCB
More favorable electrical properties, such as usability at higher AC frequencies
Less waste during production
Lower cost price of electronic components and assembly
Wave soldering:
We use a soldering line for wave soldering for more flexibility and shorter production times. The special feature of our EPM wave soldering machine is that it can solder both lead and lead-free because of the presence of two solder baths.
CIG Duplex
CIG Duplex – EPM wave soldering machine
Flexible soldering process
This wave soldering machine solves all conventional and glued SMD components on a printed circuit board. To this end, the pre-assembled printed circuit boards are placed in a so-called carrier with all components and automatically transported through the machine.
Clean soldering
In order to obtain the purest possible soldering, the actual soldering process takes place in an environment that is filled with nitrogen.
Traceability
Various parameters are monitored during the wave soldering process. These parameters (used flux, temperature of the print, wave speed, contact time and temperature of the wave) are automatically linked to the serial number of the relevant print. This ensures complete traceability of the brazing specifications. These data are stored individually per print, creating a total picture of the production process of a product at serial number level.
Coating / Potting:
An increasing need arises to apply industrial electronics within more aggressive environmental conditions. Printing circuit boards with a conformal coating is used as a means to protect the electronics against the environment.
For our paint process we use the DIMA HC-200 lacquer machine.
DIMA HC-200
DIMA HC-200
This machine is equipped with four different nozzles, where 1 cup can spray at a maximum angle of 45 degrees. With the help of this spray head it is therefore easy to spray around components where no paint may come on. This means that components do not have to be covered. One should think of connectors, dipswitches, displays, etc.
Conformal coating
The paint process is standard for: the Dymax 984 LVUF, an ultraviolet curing lacquer. We also have the possibility to apply other paints on request.
Selective soldering:
For the assembly of PCBs and other electronics there are three soldering techniques:
machine wave soldering for simple soldering in large numbers,
hand soldering for small-scale work
selective soldering for precision work of high quality
The selective soldering machine works just as with hand soldering with small dots, but exactly in the right position and without any waste of tin. This results in an extremely stable constant quality, which is meticulously produced in accordance with the design. This is a requirement in, for example, the medical and aircraft industry, for which Q Products is active. But other industries also demand top quality. Less tin and energy is used, making it possible to work more sustainably.
Thanks to the precision soldering, smaller components can be assembled. They are getting smaller and smaller, because devices are getting smaller and smaller. We contribute to this development thanks to this machine.